Honghua ChenResearch Assistant Professor
School of Data Science |
![]() |
I am currently a Research Assistant Professor at the School of Data Science, Lingnan University, Hong Kong.
From 2023 to 2025, I was a Research Fellow at the
MMLab@NTU and
S-Lab,
Nanyang Technological University (NTU), Singapore,
where I worked with Prof. Xingang Pan and
Prof. Chen Change Loy.
Before joining NTU, I obtained the PhD degree in 2022 from NUAA and was supervised by Prof. Jun Wang. Meanwhile, I worked closely with Prof. Mingqiang Wei.
From 2020 to 2022, I was a Research Assistant at The Chinese University of Hong Kong (CUHK) and
Hong Kong Center for Logistics Robotics.
My research interests include 3D Vision/AIGC, 3D Measurement, Computer Graphics, and Geometric Deep Learning.
Selected papers are organized into a cleaner theme-separated layout. Kindly check the full list [Google Scholar].
† corresponding author, ‡ co-first author.
3D Editing & Generation | |
|
IEEE TVCG, 2026 [code]
|
|
|
SIGGRAPH Asia, 2025 [code]
|
|
![]() |
ICCV, 2025 [code]
|
|
arXiv preprint, 2024 [code]
|
|
![]() |
CVPR, 2024 [code]
|
3D Reconstruction & Registration | |
![]() |
RGGT: A Generative-Prior-Guided Transformer for Unified Rigid and Non-Rigid Point Cloud Registration
ICML 2026
|
|
ICLR, 2026 [code]
|
|
![]() |
ICCV, 2025 [code]
|
![]() |
IEEE TGRS, 2024
|
![]() |
SIGGRAPH, 2022
|
![]() |
CGF, 2022 [code]
|
![]() |
IEEE RA-L, 2021
|
3D Low-Level Processing | |
![]() |
AAAI, 2026 [code]
|
![]() |
ACM TOG, 2025
|
![]() |
IJCV, 2025 [code]
|
![]() |
IEEE TVCG, 2025 [code]
|
![]() |
IEEE TPAMI, 2024 [code]
|
![]() |
ACM TOMM, 2023 [data]
|
![]() |
IEEE TVCG, 2023 [code]
|
![]() |
ICCV, 2023 [code]
|
![]() |
IEEE TPAMI, 2022 [code]
|
![]() |
IJCV, 2021 [code]
|
![]() |
IEEE TVCG, 2021
|
![]() |
CVPR, 2020 [code]
|
![]() |
CAD, 2019
|
![]() |
IEEE TVCG, 2019 [code]
|
3D Analysis and Industry-Level Application | |
![]() |
ICLR, 2026 [code]
|
![]() |
CVPR, 2025 [code]
|
![]() |
IEEE TIM, 2024 [data]
|
![]() |
IEEE TIM, 2024 [data]
|
![]() |
IEEE TIM, 2022
|
![]() |
IEEE TASE, 2022 [data]
|
![]() |
机械工程学报, 2022
|
![]() |
CAD, 2020
|
| National Scholarship in China (the highest scholarship for students in China), 2021 |
| Best Paper Oral Presentation Award, CIDE&DEA, 2020 |
| Stars Innovation Nomination Award, NUAA, 2020 |
| Suzhou Industrial Park Scholarship, NUAA, 2019 |
| Pacific Graphics 2026 Program Committee |
| Cyberworlds 2025 Program Committee and Poster Chair |
| ACM TOMM (SCI & CCF B) Special Issue Guest Editor |
| Reviewer: ICLR, ICML, AAAI, CVPR, ECCV, ICCV, SIGGRAPH, IEEE TPAMI/TIP/TVCG/TASE/TMM/TNNLS, IJCV, CAD, Pattern Recognition, The Visual Computer, Computer & Graphics, Measurement, CAD/CG 2020 |